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SHRINK-WRAPPED NEW: SMART RF PASSIVE COMPONENTS 2011 HARDCOVER

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Specificaties

Objectstaat
Nieuw: Een nieuw, ongelezen en ongebruikt boek in perfecte staat waarin geen bladzijden ontbreken of ...
Book Title
Passive RF Component Technology: Materials, Techniques, and
Item Height
10 inches
ISBN-10
1608071995
Item Length
7.25 inches
Item Width
1 inches
Item Weight
1.55 pounds
ISBN
9781608071999
Publication Year
2011
Type
Textbook
Format
Hardcover
Language
English
Publication Name
Passive Component RF Technology : Materials, Techniques, and Applications
Author
Bo Pan, Guo'an Wang
Publisher
Artech House
Number of Pages
290 Pages

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Product Information

Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.

Product Identifiers

Publisher
Artech House
ISBN-10
1608071995
ISBN-13
9781608071999
eBay Product ID (ePID)
110939091

Product Key Features

Author
Bo Pan, Guo'an Wang
Publication Name
Passive Component RF Technology : Materials, Techniques, and Applications
Format
Hardcover
Language
English
Publication Year
2011
Type
Textbook
Number of Pages
290 Pages

Additional Product Features

Lc Classification Number
Tk6560.P315 2012
Edition Description
Unabridged Edition
Table of Content
Introduction; Overview of RF Passives and Enabling Materials - Passive Filters. Combiners, Dividers, Hybrids, and Couplers. Inductors, Transformers, and Baluns. Antennas. Summary.; Novel Flexible Material Liquid Crystal Polymer (LCP) Based Flexible Passives -Introduction. LCP Properties. Multilayer LCP Process Development. Design and Fabrication of LCP-based Tunable RF Passive. LCP for 3D Integration and Packaging. Summary.; Ferroelectric-based Tunable RF Capacitor -Introduction. BST Materials for RF Capacitors. Ferroelectric Capacitor with Low Tuning Voltage and High Linearity. Low Conductor Loss Capacitor. Embedded Ferroelectric Capacitor. Summary. Future Prospects.; High Aspect Ratio RF Passives Enabled by Smart RF Materials and Polymer-core Conductor Micromachining Technologies -Introduction. Properties of SU-8 Polymer. TheIntroduction of Polymer-core Conductor Micromachining Technology. High-Q RF Inductors by This Approach. High-performance Millimeter-wave Antennas Using the Polymer-core Conductor Approach. High-aspect-ratio Micromachined Filters, Duplexer, and Coupler. Summary.; CNT-based Passive Circuits and Detectable Components -Introduction. CNT-based Transmission Line and Interconnect. CNT-based Flexible and Pattern-Agile Antennas. CNT-based RF Wireless Transducer. Summary.; Paper-based Green RFID and Other Passives -Introduction. RFID and Its Applications. Paper-based Green RFID. Smart RFID. Summary.; Flexible Magnetic Composites -Introduction. Flexible Magnetic Composites. Flexible Magnetic Composites for Biomonitoring Applications. Summary.; Composite Right-/Left-handed Metamaterials and Their RF Applications -Introduction. Left-handed Metamaterials and Basic Concepts. Transmission-line Approach. Zeroth-order Resonators with Double Resonances and Their Applications to Polarization-controllable Antennas. Nonreciprocal Metamaterials and Their Applications to Traveling-wave Resonators and Beam-steering Antennas. Summary.; Designing Novel On-chip Millimeter Wave Passives -Introduction to On-chip Novel Passive Device Design. Tunable Delay Transmission Line with Fixed Characteristic Impedance. Two-state Single-turn Spiral Inductor of Reconfigurable RF Circuits. On-chip Frequency-dependent Inductor for Multi-band Circuit Designs. Through-silicon-via (TSV) MMW Passives for 3D Package Environment. Summary.; About the Authors. Index.;
Copyright Date
2012
Target Audience
Scholarly & Professional
Topic
Radio, Electronics / General, Microwaves
Lccn
2011-276708
Illustrated
Yes
Genre
Technology & Engineering

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